| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a filletless type chip resistor in which burrs or ships can be prevented from being generated in an electrode at the dividing. SOLUTION: In this method for manufacturing a chip resistor 10, lower layer electrodes 2 are arranged across a vertical groove on the upper face of an original plate, in which plural insulating substrates prior to division are vertically and horizontally blocked along a vertical groove and a horizontal groove, and the lower later electrode 2 are connected through resistor film 3, and the entire face of the resistor film 3 is covered by a lower layer protecting film 4 and the resistor film 3 is subjected to laser trimming from the upper part of the lower layer protecting film 4, and the lower layer protecting film 4 is covered by an upper protecting film 5. After or at the same time as the formation of the upper protecting film 5, separated layers 6 extended along the vertical groove are formed, and then upper electrodes 7 are arranged between the upper layer protecting film 5 and the separated layers 6. Afterwards, the original plate is divided from the vertical groove and the horizontal groove, and plated films are formed on the upper electrodes 7.</p> |
