发明名称 METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER
摘要 Sufficiently good soldering results can not be obtained using known methods for tinning copper surfaces. In particular, the surfaces remain incapable of being soldered after thermal treatment. To eliminate this problem, a method is used for coating surfaces of copper or of a copper alloy with a layer made of tin or of a tin alloy. Said method comprises the essential following steps: a) treating the surfaces with a solution containing at least one noble metal compound in order to deposit noble metal; b) treating the surfaces which are coated with noble metal according to step a) with a solution containing at least one tin compound, at least one acid and at least one complexing agent for copper from the group comprised of thiourea and the derivatives thereof in order to form the tin or tin alloy layer.
申请公布号 CA2326049(A1) 申请公布日期 1999.11.04
申请号 CA19992326049 申请日期 1999.04.15
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 MAHLKOW, HARTMUT;BACKUS, PETRA
分类号 C23C18/28;C23C18/31;H05K3/24;(IPC1-7):C23C18/28 主分类号 C23C18/28
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