摘要 |
A screening device for an electronic module or sub-assembly, in which at least one screen wall (e.g. (1,6)) of the sub- assembly has wall-part with a number of closely arranged holes with a metallic earthed screening layer (e.g. (2,7)) for electromagnetic screening and heat dissipation for the sub- assembly. The screen wall (e.g. (1,6)) has two screening layers (e.g. (2,7)) which extend approximately parallel to one another with space in between. The screening layers specifically consist of stainless steel screening plates or sheets (2).
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