发明名称 |
PROCEDE ET APPAREIL DE TRAITEMENT DE SURFACES METALLIQUES PAR VOIE SECHE |
摘要 |
The invention concerns a dry process surface treatment method for treating at least a metal surface portion, wherein the portion is treated at a pressure close to atmospheric pressure with a treating gas stream comprising excited and unstable species, which consists in locally increasing the treating gas pressure on the metal surface portion so as to force the l species to move along a direction substantially perpendicular to the surface. The invention is useful for wave brazing electronic components on printed circuit wafers.
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申请公布号 |
FR2778190(A1) |
申请公布日期 |
1999.11.05 |
申请号 |
FR19980005603 |
申请日期 |
1998.05.04 |
申请人 |
L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
发明人 |
VERBOCKHAVEN DENIS;RABIA STEPHANE;SINDZINGRE THIERRY |
分类号 |
B23K1/20;C23F4/00;C23G5/00;H05K3/34;(IPC1-7):C23G5/00;C23G3/00;B23K35/38;B23K37/04;H05K13/00 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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