Verfahren, um gestapelte Halbleiterchips zusammenzuschalten und Bauelement,申请号DE1994620917-传众专利搜索

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发明名称	Verfahren, um gestapelte Halbleiterchips zusammenzuschalten und Bauelement
摘要
申请公布号	DE69420917(D1)	申请公布日期	1999.11.04
申请号	DE1994620917	申请日期	1994.08.05
申请人	THOMSON-CSF, PARIS	发明人	VAL, CHRISTIAN
分类号	H01L25/18;H01L25/065;H01L25/07;(IPC1-7):H01L25/065;H01L21/50	主分类号	H01L25/18
代理机构		代理人
主权项
地址

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