发明名称 METHOD AND APPARATUS FOR THIN FILM DEPOSITION ON LARGE AREA SUBSTRATES
摘要 A thin film deposition apparatus (10, 10) is used for applying thin films onto substrates (18), such as large panel displays, as well as integrated circuit devices, and includes a source of an ionized gas (32, 38) that is intermixed with an aerosol (45) prior to deposition. The ionized gas (38, 32) causes the aerosol particles (73A) to take on an electrical charge. The aerosol containing the charged particles is concentrated in a virtual impactor (77, 88) and then provided to a shower head or orifice (16, 114, 130, 127) that is used for depositing the aerosol material onto the substrate (18). The shower head (127) can be moved in a selected pattern to uniformly deposit aerosol particles as a thin film on the substrate (18).
申请公布号 WO9955466(A1) 申请公布日期 1999.11.04
申请号 WO1999US09010 申请日期 1999.04.26
申请人 MSP CORPORATION 发明人 SUN, JAMES, J.;LIU, BENJAMIN, Y., H.;MARPLE, VIRGIL, A.
分类号 B05B5/00;B05B5/03;B05B7/00;B05B13/04;B05D1/04;C23C16/44;C23C16/448;C23C16/453;C23C16/455;(IPC1-7):B05B7/00 主分类号 B05B5/00
代理机构 代理人
主权项
地址