Magnetron sputtering unit for multilayer coating of substrates especially in small to medium runs or in laboratories

摘要

A magnetron sputtering apparatus for multilayer coating of substrates has a polygonal sputtering target arrangement which is rotated in steps for sequential exposure of its individual targets to ion bombardment. A magnetron sputtering apparatus for multilayer coating of substrates has a sputtering target system which is located preferably centrally within an outer magnetron and which consists of a hollow polygonal (preferably triangular or rectangular) arrangement of individual targets. An inner magnetron is located within the hollow polygon and a screen allows exposure of preferably only one individual target to ion bombardment. The sputtering target system can be rotated about its polygonal symmetry axis in angular steps corresponding to the symmetry degree of the hollow polygon so that the targets are sequentially exposed to ion bombardment. An Independent claim is also included for a multilayer PVD coating process, carried out by controlled rotation of a sputtering target system about its polygonal symmetry axis in angular steps corresponding to the symmetry degree of the hollow polygon.