FLIP CHIP WITH INTEGRATED FLUX, MASK AND UNDERFILL

摘要

A flip chip having solder bumps (118), an integrated underfill (114), and a separate flux coating (120), as well as methods for making such a device, is described. The device is characterized in that the underfill material (114) is provided on the chip surface prior to the application of solder bumps, and then optionally treated to form apertures (116) therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.