METHOD OF MAKING MICROWAVE, MULTIFUNCTION MODULES USING FLUOROPOLYMER COMPOSITE SUBSTRATES

摘要

A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates (1-10) into a multilayer structure (200) using fusion bonding. The bonded multilayers (1-10), with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module (200). Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.