Method and apparatus for processing workpieces with multiple polishing elements

摘要

A chemical mechanical planarization (CMP) system includes multiple workpiece processing elements arranged in a vertically staggered configuration. The polishing elements are positioned such that an outer edge of a first polishing element overlaps the inner edge of a second polishing element. The overlapping arrangement enables the CMP system to utilize additional polishing elements without substantially increasing the footprint of the CMP system. Each of the polishing elements exhibit different polishing characteristics to enable multiple-step workpiece processing.