| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition excellent in mold releasability, adhesion to semiconductor elements and transparency by compounding an epoxy resin, a curing agent, a saline coupling agent containing an epoxy group or the like and a mold releasing agent. SOLUTION: There are compounded an epoxy resin having an epoxy equivalent of preferably 100-1,000 and a softening point of not higher than 120 deg.C (e.g. bisphenol A type epoxy resins); a curing agent, preferably an acid anhydride (e.g. hexahydrophthalic anhydride); a silane coupling agent having an epoxy, SH or amino group, preferably represented by formula III; and mold releasing agents containing structures represented by formulae I and II, the wt. ratio of the portion having the structure of formula II being 25-95 wt.% of the total molecule. In the formulae I and II, (m) is 8-100; (n) is an optional positive number; Y is a monovalent organic group having an epoxy, SH or amino group R<1> -R<3> are each OCH3 , OC2 H5 , CH3 or C2 H5 , and at least one of them is OCH3 or OC2 H5 ; and R<4> is a 2-5C alkylene. |
