发明名称 INORGANIC COMPOSITE AND ITS MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To ensure the electric conductivity and/or radio wave absorbency and to enhance the fire resistance, compressive strength and bending strength by incorporating into an inorganic composite an alkali silicate soln., metallic silicon (alloy), a cement, an inorg. aggregate and an electrically conductive fibrous material and/or a radio wave absorbing powder. SOLUTION: A binder is composed of >=45 wt.% alkali silicate soln. selected from among sodium silicate soln., potassium silicate soln. and water glass, <=55 wt.% metallic silicon (alloy) selected from among metallic silicon, metallic silicon-silicon dioxide mixture and Fe-Si alloy and <=25 wt.% cement such as ordinary Portland cement, high early strength Portland cement, alumina cement or three-component cement, and <=40 wt.% of the binder is mixed with an inorg. aggregate such as an artificial or natural lightweight aggregate, an artificial ceramic aggregate, broken native rock or smashed sand and an electrically conductive fibrous material and/or a radio wave absorbing powder.</p>
申请公布号 JPH11302065(A) 申请公布日期 1999.11.02
申请号 JP19980129651 申请日期 1998.04.22
申请人 FUJITA CORP 发明人 AOKI HARUO;NAKAGAWA TERUO
分类号 C04B14/38;C04B22/04;C04B28/26;C04B111/28;(IPC1-7):C04B28/26 主分类号 C04B14/38
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