发明名称 SUBSTRATE POLISHING GRINDING WHEEL MECHANISM AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide board polishing grinding wheel mechanism and a polishing device capable of effectively feeding an abrasive liquid to a part of a substrate being polished by a grinding wheel. SOLUTION: In a substrate polishing grinding wheel mechanism for making a polished board abut to the surface of a wheel 10 to polish the polished board by mutual relative motion, a grinding wheel 10 is provided with a plurality of abrasive liquid feed ports 11 in the polishing surface for polishing the polished board. In this case, an abrasive solution is fed to the feed port 11 only when the feed port 11 is positioned in a specified position by providing an abrasive solution feed pipe 35 extended from each feed port 11 toward the rotational center of the grinding wheel 10, and an abrasive solution lead-in pipe 40 connected through a seal part when the grinding wheel 10 is rotated and the end part on the opposite side to the feed port 11 side of the abrasive solution feed pipe 35 is positioned in the specified position.
申请公布号 JPH11300603(A) 申请公布日期 1999.11.02
申请号 JP19980114853 申请日期 1998.04.24
申请人 EBARA CORP 发明人 HIROKAWA KAZUTO;HIYAMA HIROKUNI;WADA TAKETAKA;MATSUO NAONORI
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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