发明名称 RESIN COMPOSITION FOR HEAT RESISTANT PLASTIC CARD
摘要 <p>PROBLEM TO BE SOLVED: To obtain a resin composition giving plastic card excellent in heat resistance and morphological stability by including polycarbonate resin and isophthalic acid modified polyethylene terephthalate. SOLUTION: This composition includes (A) 100 pts.wt of polycarbonate resin preferably having a viscosity average molecular weight of 10,000 to 100,000 and (B) 0.5 to 40 pts.wt. of the isophthalic acid modified polyethylene terephthalate having intrinsic viscosity of 0.7 to 1.2 measured in conformity to JIS K-7233. The amount of the isophthalic acid component in the component (B) is preferably 5 to 30 mole % based on the sum of the isophthalic acid and terephthalic acid used as monomers. A heat resistant plastic card excellent in adhesivity of a protective layer comprising thermoplastic resin established at least one side of the surface of the plastic card base is obtained.</p>
申请公布号 JPH11302525(A) 申请公布日期 1999.11.02
申请号 JP19980126717 申请日期 1998.04.20
申请人 SUMITOMO DOW LTD 发明人 KAWAMOTO NAOYOSHI;TOMARI YUKIO;NAKADA YOSHIYUKI
分类号 B42D15/10;C08J5/18;C08L69/00;(IPC1-7):C08L69/00 主分类号 B42D15/10
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