| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a heatsink of a thin metallic plate which can ensure a sufficiently long interface with molding resin from the exposed part to the semiconductor die. SOLUTION: A heatsink 4 is formed by pressing a thin metallic plate. The heatsink 4 is provided with a lead supporting surface 19 around it, a hollow semiconductor die mounting surface 20 and an exposed protuberance on the opposite side. The heatsink 4 has a long interface with encapsulating resin 10 to reduce penetration of contaminants into the package. A rolled thin metallic plate is easy to work continuously and is relatively less expensive. A support bar 6 is connected to the heatsink 4 by caulking. An insulating sheet 7 to which no adhesive is applied is sandwiched between the heatsink 4 and leads 5. The reliability of connection is improved by eliminating the adhesive. The operations such as curing adhesive and dry-cleaning the leads can be eliminated. |
