发明名称 |
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same |
摘要 |
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 mu m and specific surface of from 0.1 to 1.5 m2/g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
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申请公布号 |
US5977490(A) |
申请公布日期 |
1999.11.02 |
申请号 |
US19970780329 |
申请日期 |
1997.01.08 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;DAI-ICHI KOGYO SEIYAKU CO. LTD.;DOWA MINING CO., LTD. |
发明人 |
KAWAKITA, KOUJI;NAKATANI, SEIICHI;OGAWA, TATSUO;SUEHIRO, MASATOSHI;IWAISAKO, KOUICHI;AKIYAMA, HIDEO |
分类号 |
H01B1/22;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K1/11;C08K3/08 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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