发明名称 GRINDING WHEEL WITH EXTRA-ABRASIVE GRAIN
摘要 PROBLEM TO BE SOLVED: To simultaneously realize rough machining and finish machining, omitting cutting from a process requiring cutting as rough machining due to the insufficiency of material eliminating capacity of a conventional resin bonded, metal bonded and vitrified bonded grinding wheel in grinding steel material, non-ferrous metal material or composite material. SOLUTION: Under grinding conditions of grinding wheel peripheral velocity being 40 m/sec or more and material elimination rate per grinding action face unit width of the grinding wheel being 5 mm<3> /mm/sec or more, extra-abrasive grains 3 of 100-1000μm in average grain diameter with grain diameter dispersion selected within 30μm are rigidly fixed in one layer to a base metal 1 with a binder. In this grinding wheel with extra-abrasive grain, the protruding end dispersion of the extra-abrasive grains 3 is to be within 30μm, and the respective extra-abrasive grains 3 are distributed almost uniformly at spaces of 100μm or more.
申请公布号 JPH11300620(A) 申请公布日期 1999.11.02
申请号 JP19980150516 申请日期 1998.04.21
申请人 OSAKA DIAMOND IND CO LTD 发明人 TANAKA MASARU;BANSHO KEIICHI;FUKUNISHI TOSHIO;NAKAO HIROSHI
分类号 B24D3/00;B23K9/04;B23K35/368;(IPC1-7):B24D3/00 主分类号 B24D3/00
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