| 摘要 |
PROBLEM TO BE SOLVED: To prevent the partial wear of a surface table so as to improve the operation rate of a device. SOLUTION: This polishing device is provided with a surface table 1 divided in an inner peripheral surface table part 11 and an outer peripheral surface table part 13, and a carrier 5. The inner peripheral surface table part 11 and the outer peripheral surface table part 13 are rotated in reverse directions, and the rotating speeds of the inner peripheral surface table part 11 and outer peripheral surface table part 13 are respectively set in such a way that the average relative speed of a wafer 200 and the outer peripheral surface table part 13 is almost equal to the average relative speed of the wafer 200 and inner peripheral surface table part 11. The wear quantity of a polishing pad 11a of the inner peripheral surface table part 11 can therefore be made almost equal to that of a polishing pad 13a of the outer peripheral surface table part 13. It is desirable to oscillate the wafer 200 so as to overhang from the inner edge of the inner peripheral surface table part 11 and the outer edge of the outer peripheral surface table part 13. |
