发明名称 MOLDING METHOD FOR RESIN AND MOLD EQUIPMENT FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a molding method for a resin wherein after the resin for molding is supplied into a cavity and molded, a first mold and a second mold are separated and a cured material of the resin for molding is removed and formed and wherein the cured material of the resin for molding can be removed in a joined state and is hardly left in the mold, and mold equipment for molding which allows removal of the cured material of the resin for molding in the joined state and makes the cured material hardly left in the mold. SOLUTION: A counter plunger 18 is provided beforehand so that it is opposed to an injection plunger 17, on the other side of a face whereon a first mold 11 and a second mold 12 come into contact with each other. After the injection plunger 17 and the counter plunger 18 are separated from a cured material B of resin for molding in a state wherein the first mold 11 and the second mold 12 are brought into contact with each other, the first mold 11 and the second mold 12 are separated and the cured material B of the resin for molding is removed.
申请公布号 JPH11300781(A) 申请公布日期 1999.11.02
申请号 JP19980112328 申请日期 1998.04.22
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OKAMOTO AKIHIRO
分类号 B29C45/42;B29C45/02;B29C45/13;B29C45/14;B29C45/64;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/42
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