发明名称 APPARATUS FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for molding a resin which can prevent lowering of the quality of a molded article by preventing occurrence of external pinholes and internal voids. SOLUTION: This apparatus is equipped with a pot supplied with a powderlike molding material 2, a runner opening in one end of the pot, a cavity communicating with the runner and an injection plunger which is provided in the pot so that it can be driven to advance and retreat and which presses the molding material in the pot when it advances. Besides, it is equipped with a pressure control plunger 6 which is provided opposite to the injection plunger so that it can be driven to advance and retreat and also is formed to be different in the diameter from the injection plunger and which closes the opening part of the runner in the pot while making the opening part of the runner open at the position of retreat. A pressure control device 23 for controlling the pressure control plunger 6 is provided and the pressure control device 23 and the pressure control plunger 6 are connected by an engaging means 40.
申请公布号 JPH11300782(A) 申请公布日期 1999.11.02
申请号 JP19980113982 申请日期 1998.04.23
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NISHIDE YASUTAKA
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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