| 摘要 |
<p>PROBLEM TO BE SOLVED: To simplify a conveying mechanism, to miniaturize a device in size and to reduce the device cost by making the conveying/holding mechanism of a wafer a vacuum chuck type, and rockably fitting a chuck member protrusively outward to an opening section formed at the tip section of a substrate section. SOLUTION: A substrate section 16 is constituted of an upper plate 16a formed with a long groove 14a serving as an air passage 14 on the lower face and a lower plate 16b screwed to the upper plate 16a to close the long groove 14a, and an opening section 18 is bored on the surface of the tip section of the upper plate 16a. A suction hole 24 communicated with the air passage 14 is formed at the center section of a tubular main body 22, and a circular packing member 28 fitted into a circular groove 26 at the outer peripheral section of the tubular main body 22 is supported on the support step section 32 of a base ring member 30 to form a chuck member 20. The air passage 14 and the suction hole 24 are set to a decompressed state by the action of an air sucking means 38 communicated and connected to a suction hole 36 formed on the surface of the rear end section of the upper plate 16a, and a wafer is sucked to the suction hole 24.</p> |
