| 摘要 |
A base film 9 on which a first pattern 31 is formed and a conductive foil 12 on which a second pattern 32 is formed are laminated by being passed through a gap between laminating rolls 7a, 7b which are provided with an adjusting means for adjusting the gap width and parallelism between them. Then, a relative position between the first pattern 31 and the second pattern 32 is detected. After patterning the conductive foil 12 to form a wiring 12w, displacements of the first pattern 31 and the second pattern 32 are detected, and the gap width and parallelism between the laminating rolls 7a, 7b are adjusted corresponding to the detected displacements. Thus, the laminate can be formed uniformly, and the base film 9 and the wiring 12 can be prevented from being deformed with the release of a residual stress in the patterning step. According to the manufacturing method of a high-precision film carrier tape, highly-integrated semiconductor devices are mounted with high productivity.
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