发明名称 Wiring pattern for a semiconductor integrated circuit device
摘要 In a C-MOS type output circuit, desired connections between a P-MOS transistor and an N-MOS transistor are achieved without forming a third wiring layer. In a semiconductor integrated circuit device in which a group of P-MOS transistors and a group of N-MOS transistors are formed on a semiconductor substrate, in which the transistors are arranged with their channel length aligned with the direction in which free space is available within the semiconductor chip, and in which the transistors are connected in a predetermined manner with wiring patterns laid on the semiconductor substrate, a power source line and a ground line, each formed as a wiring pattern in a second wiring layer, each have a portion thereof separated from a remaining portion thereof by a circular groove so that an isolated wiring region is formed within each of the power source line and the ground line so as to be connected, by way of a via hole, to wiring patterns that are formed linearly and parallel to one another in a first wiring layer to connect between the group of P-MOS transistors and the group of N-MOS transistors.
申请公布号 US5977573(A) 申请公布日期 1999.11.02
申请号 US19980112459 申请日期 1998.07.09
申请人 ROHM CO., LTD. 发明人 HIRAGA, NORIAKI
分类号 H01L21/3205;H01L21/822;H01L21/8238;H01L23/52;H01L27/04;H01L27/092;(IPC1-7):H01L27/10 主分类号 H01L21/3205
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