| 摘要 |
PROBLEM TO BE SOLVED: To obtain a binder which can be heat-decomposed at a lower temperature by mixing a depolymerizable polymer with an organic peroxide. SOLUTION: A depolymerizable polymer such as a (meth)acrylic resin or an a-methylstyrene resin is mixed with 0.1-3 wt.% organic peroxide having a 1-min half-life temperature of 140-240 deg.C and selected among peroxyketals, hydroperoxides, dialkyl peroxides, peroxy esters, and ketone peroxides to obtain a binder. When this binder is used as a vehicle for a glass paste for forming a protective coat for a thick-film element such as a dielectric for forming a thick-film circuit or a resistor capacitor, the paste can be fired at a temperature as low as 400-500 deg.C, and the binder can therefore be removed before the low- melting point glass begins melting to prevent the glass from forming bubbles. |
