发明名称 Method for dry-etching a platinum thin film
摘要 A method for dry etching a metallic thin film (i.e., platinum thin film) is disclosed whereby a clean metallic thin film can be formed by restraining redeposition of the metal. The etching gas includes a mixed gas including Cl2 and SiCl4 whereby a plasma of the mixed gas generates reactive species to react with the metallic thin film and form volatile residua that can be desorbed from the etched surface.
申请公布号 US5976394(A) 申请公布日期 1999.11.02
申请号 US19970842828 申请日期 1997.04.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHUNG, CHEE-WON
分类号 C23F4/00;H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/306 主分类号 C23F4/00
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