发明名称 |
Method for dry-etching a platinum thin film |
摘要 |
A method for dry etching a metallic thin film (i.e., platinum thin film) is disclosed whereby a clean metallic thin film can be formed by restraining redeposition of the metal. The etching gas includes a mixed gas including Cl2 and SiCl4 whereby a plasma of the mixed gas generates reactive species to react with the metallic thin film and form volatile residua that can be desorbed from the etched surface.
|
申请公布号 |
US5976394(A) |
申请公布日期 |
1999.11.02 |
申请号 |
US19970842828 |
申请日期 |
1997.04.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG, CHEE-WON |
分类号 |
C23F4/00;H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/306 |
主分类号 |
C23F4/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|