发明名称 |
Semiconductor device and assembly board having through-holes filled with filling core |
摘要 |
A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.
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申请公布号 |
US5978222(A) |
申请公布日期 |
1999.11.02 |
申请号 |
US19970924958 |
申请日期 |
1997.09.08 |
申请人 |
FUJITSU LIMITED |
发明人 |
IIJIMA, MAKOTO;WAKABAYASHI, TETSUSHI;HAMANO, TOSHIO;MINAMIZAWA, MASAHARU;TAKENAKA, MASASHI;YAMASHITA, TATUROU;MIZUKOSHI, MASATAKA |
分类号 |
H01L23/12;H01L21/48;H01L21/60;H01L23/10;H01L23/14;H01L23/24;H01L23/31;H01L23/498;H01L25/065;H01L25/18;H05K3/46;(IPC1-7):H05T7/20 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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