| 摘要 |
A method and apparatus for performing a function on an integrated circuit having a plurality of electrical contact pads is disclosed. The apparatus includes a substrate for performing the function on the integrated circuit, the substrate having a plurality of electrical contact pads and at least one electrical test contact pad. A centering housing encompasses the integrated circuit and centers the integrated circuit with respect to the substrate such that the plurality of electrical contact pads of the integrated circuit electrically connects with the plurality of electrical contact pads of the substrate. A test connector connects integrated circuit to the substrate. The test connector includes a body, at least one electrical pin positioned on the body for interconnection with external circuitry, at least one electrical test contact pad positioned on the cover for electrical contact with the electrical test contact pad of the substrate, and a flexible membrane positioned on the body for providing a force to the integrated circuit, thereby forcing the integrated circuit in electrical connection with the test substrate.
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