| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board in which a desired circuit element can be firmly adhered to a desired position easily and surely without using any special adhesive or mechanical means, the printed circuit board itself can be adhered to a desired member and further, a fine circuit can be easily formed and to provide a copper thin film substrate to be utilized in manufacturing the printed circuit board. SOLUTION: The copper thin film substrate 10 is prepared by forming a molten adhesive layer 14 consisting of a thermoplastic polyimide resin on one of the main surface of a main body layer consisting of a heat resistant insulation base material 11, forming a copper thin film layer 12 by a sputtering method as a first layer on the other main surface and forming a copper thick layer 13 by an electric plating method as a second layer on the copper thin film layer 12. The printed circuit board manufactured by using the copper thin film substrate 10 is also prepared.
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