发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 PURPOSE:To obtain a cooling mechanism, in which the required space of the entire body is reduced and the temperature difference between chips is made small, by forming a refrigerant distributing part and a refrigerant collecting part at one end of a package, and forming a refrigerant flowing path at the opposite end part. CONSTITUTION:At one end part of a package, a refrigerant distributing part 5a and a refrigerant collecting part 6a are laminated in the up and down direction. A flow path 4c, which connects minute refrigerant pipes 4a and 4b, is formed at the facing other end. Refrigerant 9a from the outside is equally distributed to the pipes 4a through the distributing part 5a, collected at the collecting part 6a through the flow path 4c and the pipes 4b and discharged to the outside.
申请公布号 JPS6318649(A) 申请公布日期 1988.01.26
申请号 JP19860162149 申请日期 1986.07.11
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 KISHIMOTO TORU;OSAKI TAKAAKI
分类号 H01L23/34;H01L23/473 主分类号 H01L23/34
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