发明名称 |
Controlling impedances of an integrated circuit |
摘要 |
A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.
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申请公布号 |
US5976911(A) |
申请公布日期 |
1999.11.02 |
申请号 |
US19980163132 |
申请日期 |
1998.09.29 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BRUCE, JEFFREY D.;ROBERTS, GORDON D.;SCHOENFELD, AARON M. |
分类号 |
H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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