首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
HIGH DENSITY PLASMA ETCHING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100228374(B1)
申请公布日期
1999.11.01
申请号
KR19960064459
申请日期
1996.12.11
申请人
HYUNDAI ELECTRONICS IND. CO.,LTD
发明人
KIM, SUNG-KI;NA, WON-KYU;OH, SANG-RYONG;CHANG, JE-WOOK
分类号
H01L21/306;(IPC1-7):H01L21/306
主分类号
H01L21/306
代理机构
代理人
主权项
地址
您可能感兴趣的专利
RUBBER COMPOSITE FOR TIRE TREAD
PIPING STRUCTURE NEAR FORCE SENSOR
MANUFACTURE OF MULTIBLADE GRINDSTONE
GRINDSTONE
PARTS FEEDING DEVICE
RECIPROCATING ELECTRIC RAZOR
OSTOMY INSTRUMENT AND PRESSURE RING ASSEMBLY THEREFOR
LOCK DEVICE OF BELT USED IN LIFT APPARATUS
SWITCHING APPARATUS FOR ELECTRIC COOKER
SWITCHING POWER SUPPLY DEVICE
ROTOR OF ROTARY MACHINE
FACSIMILE EQUIPMENT
TIMER-INTERLOCKED ELECTRONIC VOLUME
WAFER ETCHING APPARATUS
MICROCOMPUTER CONTROL CIRCUIT FOR HIGH-FREQUENCY HEATING DEVICE
MANUFACTURE OF ELECTRICAL CONNECTOR
WINDING MACHINE FOR DEFLECTION YOKE
MEMORY DEVICE
VOLTAGE SYNTHESIZER RECEIVING DEVICE
EJECTOR MECHANISM OF ELECTRONIC CIRCUIT PACKAGE