发明名称 HALOGEN-FREE FLAME RETARDANT EPOXY RESIN COMPOSITION, PREPREG AND LAMINATING PLATE THEREOF
摘要 <p>Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.</p>
申请公布号 KR100228047(B1) 申请公布日期 1999.11.01
申请号 KR19977003609 申请日期 1997.05.29
申请人 THOSHIBA CHEMICAL CO. 发明人 HONDA, NOBUYOOKI;SUKIYAMA, CHUYOSHI;SUSKI, TECHUAKI
分类号 C08G14/06;C08G59/38;C08G59/40;C08L61/14;C08L61/26;C08L61/34;C08L63/00;H01L23/14;H01L23/29;H05K1/03;(IPC1-7):C08G59/40;C08K5/521;C08J5/24 主分类号 C08G14/06
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