| 摘要 |
PURPOSE:To make it possible to screen products having slight defects at an early time, by applying an adequate pressure to a packaged device from the outside, and mechanically increasing the pressure on the surface of a chip with a packaging resin and a filler. CONSTITUTION:In a compressing step, a packaged device 6 is fixed on a stage 10, and a pressure is applied with a pusher 11, or a pressure is applied with a high-pressure atmosphere 12 of a gas or a liquid. In any case, the adequate pressure is applied so that the main body of a chip 1 is not broken with internal strain. The pressure, which is applied on the packaged device 6, amplifies and accelerates the effects of a packaging resin 3 and a filler 4 on a memory cell, a circuit or passivation film 2 and accelerates the progress and the yield of defects, which will occur due to minute flaws and defects present on the surface of the chip 1. Thus the defective products can be effectively screened in a short time.
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