| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a multilayer electronic component by which there is no problem of constriction of a base sheet, due to heating for drying a conductive paste in a step for forming the conductive paste into the base sheet and there is no problem of displacement at the time of lamination in a step for layering multiple base sheets, in which inner electrodes are formed. SOLUTION: When a conductive paste 2 is applied on a base sheet 1 by printing, the conductive paste 2 is not directly applied by printing on the base sheet 1 but instead on the surface of a metal plate 21 different from the base sheet. After drying the conductive paste 2, it is transferred to the base sheet 1, and at the same time, the metal plate 21, a male mold is housed in a cavity 32 of a layering tool 30 which is a female mold, and the step is repeated for several times to laminate multiple base sheets in which dried conductive layers are provided. |
