| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized and thin servo amplifier by efficiently cooling heat generating components in the servo amplifier. SOLUTION: A semiconductor module 4 is mounted on printed boards 11, 12, so that a heat sink plane 4a of the semiconductor module 4 and flat planes of the printed boards 11, 12 are parallel with the inner wall face of a unit case 20. The thickness of the semiconductor module 4 such as an inverter, which is indispensable in a servo amplifier and the printed board mounted with the semiconductor module 4 combined is nearly the same as the distance between the inner walls of the unit case 20 to minimize the thickness of the servo amplifier. For the other components 13, components of such a size as to be stored in the unit case are selected. Electrolytic capacitors 3 and the like are so structured as to be stored in a plurality of segments. Furthermore, for the case of forcibly cooling the inside of the servo amplifier with a fan, an air channel is formed with guide plates, and the like which block a space or the like between the components in such a shape that air concentratedly blow against such components that require cooling. With this method, the cooling efficiency is increased, and thereby components can be located in high density, resulting in a small-sized and thin servo amplifier. |
