| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of semiconductor dies to be sealed per unit time by arranged the die between the flag part of a first lead frame and the lead part of a second lead frame, forming electrical connections and sealing the die in a molding material, thereby enhancing the rate of operation. SOLUTION: Welded flag frame and clip frame are subjected to reflow soldering process, and solder pools are fused between a semiconductor die 30 and a flag part 7 and between a lead part 19 and a pad position on the die 30. After reflow, the die 30, the flag part 7 and the pair of lead parts 19 are sealed by transfer molding, for example, for forming a semiconductor package. Finally, individual semiconductor packages are separated from the flag frame and the clip frame. Since this method employs only single-pick place step and single- reflow process, high speed package process can be realized. |
