发明名称 IC CARD AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To provide an IC card which has its both smoothed sides by securing a contact between a specific oversheet and a thin plate where an IC module is embedded and applying an electric field of frequency of a specific range to make only the treated film of the oversheet generate the heat to conduct its fusion. SOLUTION: One of both sides of a film made of the nonpolar polyethylene terephthalate resin or polybutylene terephthalate resin having a <=0.1 dielectric power factor at a frequency of 1 kHz to 1 MHz is irradiated by the ultraviolet rays or undergoes a corona discharge treatment. Thus, an oversheet 1 is obtained. Then a contact is secured between the oversheet 1 and a thin plate where an IC module 2 is embedded, and an electric field of frequency of 1 to 300 MHz is applied to the oversheet 1 to make only the treated film of the oversheet 1 generate the heat to conduct its fusion. Thus, it is possible to easily produce an IC card with its thickness uniformed and both sides smoothed.
申请公布号 JPH11296643(A) 申请公布日期 1999.10.29
申请号 JP19980102601 申请日期 1998.04.14
申请人 THREE BOND CO LTD 发明人 NEZAKI SHINJI
分类号 B42D15/10;G06K19/077 主分类号 B42D15/10
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