| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an aligner for conforming the presence of a vacuum leak among the three sections: a wafer-retaining body, a semiconductor wafer, and a contactor by securing forming thenm in a single piece due to vacuum suction. SOLUTION: An aligner 10 forms a wafer chuck 50, a wafer, and a contactor 60 into a single piece via a vacuum exhaust means after aligning them. The vacuum exhaust means is provided with a valve operation mechanism 20 for opening/closing first and second valve mechanism 51 and 52, first and second solenoid valves 26 and 27 that are successively connected from the side of a valve operation mechanism 20 to the valve operation mechanism 20 via a vacuum exhaust line 21A, and a pressure detection meter 28 for detecting vacuum leakages provided between the first solenoid valve and the valve operation mechanism 20.</p> |
