| 摘要 |
PROBLEM TO BE SOLVED: To prevent the incapability of the recognition of an alignment mark by polishing the insulating film or metallic film of a wafer. SOLUTION: An Si substrate 1 being the base substance of a wafer W is provided with a first projecting part 12a forming an alignment mark 2 on a scribe line, and dummy patterns 3 constituted of second projecting parts 12b protruding higher than the alignment mark 2 are provided at the both sides. At the time of laminating an insulating film 4 or a metallic film 5, and then polishing the surface, protrusion parts 5a of the metallic film 5 on the alignment mark 2 can be prevented from being flattened by using the dummy patterns 3 as a shield. |
