| 摘要 |
PROBLEM TO BE SOLVED: To obtain a probe card by which the electric characteristic of a chip can be measured even when the distance between adjacent pads is about 150μm or smaller. SOLUTION: A probe card 11 is used when the electric characteristic of a chip T, in a semiconductor wafer W is measured by a measuring apparatus which measures the electric characteristic of the chip T. In the probe card 11, a substrate 4 is provided, a needle holding member 12 which comprises holes 13,... formed in the substrate 4 is provided, and needles 14 which are installed, via respective springs 8, inside the holes 13,... are provided in a state that they protrude partly to the outside of the holes 13,.... The holes 13, ...are arranged zigzag. Tip sides 14a which protrude to the outside of the holes 13,... of the needles 14 installed inside the holes 13,... are bent, and their tips 14b are arranged in a straight line shape so a to correspond to pads P of the chip T to be measured. When the needles 14 come mechanically into contact with the pads P of the chip T to be measured in the semiconductor wafer W, electric signals can be input to, and output from, the pads P from the measuring apparatus.
|
