| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA(Ball Grid Array) resin molded package where an outside connecting electrode is more strongly joined to an inner wiring and which is excellent in resistance to stress after the molded package is mounted on a board. SOLUTION: A wiring 2 is formed on the one surface of a board 1, small holes 11 smaller in diameter than viaholes 10 provided in the board 1 are provided to the wiring 2 at positions corresponding to the viaholes 10. Thereafter, conductive material is melted in the viaholes 10 to form outside connecting electrodes 7. Conductive material is also filled into the small holes 11, whereby a package where the outside connecting electrodes are more strongly joined to the wiring 2 by an anchoring effect can be obtained. The viaholes 10 provided in the board 1 become through-holes communicating with the small holes 11, whereby foreign objects penetrating into the viaholes 11 in a manufacturing process are easily removed when the surface of the wiring 2 is required to be plated, so that the wiring 2 is stably plated. As a result, the connection of the wiring 2 to the outside connecting electrode 7 is stabilized in strength, so that a package excellent in resistance to stress can be obtained. |
