发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To obtain a method of mounting electronic components, whereby electronic components can be recognized in a process of mounting electronic components on mounting parts, and the mounting operation time can be possibly reduced by doing the position correction in the mounting process. SOLUTION: While one or more of a plurality of mounting heads 10 are vacuum-chucking electronic components b at a feeder m or mounting the electronic components on mounting parts n, detecting means 2 mounted on the mounting heads 10 so as to move together detect the hold condition of the electronic components b vacuum-chucked to the mounting heads 10, and the hold condition of the electronic components b is corrected based on the detected values, and the electronic components are mounted on a printed board c.
申请公布号 JPH11298198(A) 申请公布日期 1999.10.29
申请号 JP19980102318 申请日期 1998.04.14
申请人 TENRYU TECHNICS:KK 发明人 SHIMIZU YASUYUKI
分类号 B23P19/00;H05K13/04;H05K13/08 主分类号 B23P19/00
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