| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve increase in the number of wiring circuits per bus bar layer and enhancement of heat dissipation properties simultaneously by providing an independent bus bar pattern part having outside diameter substantially identical to that of a bus bar pattern part of high current level and joining it to the bus bar pattern part through an air gap. SOLUTION: An independent bus bar pattern part 4d having outside diameter substantially identical to that of a bus bar pattern part 4c of high current level is provided. A folded part 4e is applied through an air gap (t) to the upper surface of the bus bar pattern part 4c in parallel therewith and the interface between the upper surface of part 4c and the lower end of the part 4d is jointed by laser welding, or the like. Since the bus bar pattern parts 4c, 4d serve as a heat dissipation plate through the air gap (t), heat dissipation properties are enhanced. Furthermore, the number of wiring circuits per bus bar layer can be increased because the width of the part 4c is halved.</p> |
