| 摘要 |
PROBLEM TO BE SOLVED: To assemble two IC chips without changing the size of a package. SOLUTION: IC chips 1 on which bumps 3 are formed are mechanically adhered to a copper foil tape 2 to which a lead is thermally adhered from the both sides so that a package can be formed. Thus, the copper foil tape is interposed between the bumps so that the chips 1 can be stereoscopically arranged in the package, and the two chips 1 can be integrated in the package without changing the size of the package. |
