发明名称 |
FILM FOR SUPPORTING SEMICONDUCTOR CHIP |
摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a necking in an expanding process by making a film mainly of a mixture made of specific material and by establishing a certain relationship between a stress of an s-s curve to a tensile strain in the longitudinal direction and a stress of an s-s curve to a tensile strain in the lateral direction and by making the tangential coefficients of both the s-s curves in all the ranges. SOLUTION: The main constituent of a film 1 is a mixture ofα-olefin polymer of polyethylene, polypropylene, or polybutene andα-olefin copolymer having 2 to 8 carbon atoms. There is a relationship ofσr =(0.8 to 1.2)σc , whereσr is a stress of an S-S curve to the maximum tensile strain in all radial directions when the film 1 is expanded with respect to tension in the longitudinal direction of the film 1 andσc is a stress of an S-S curve to the maximum tensile strain in all radial directions when the film 1 is expanded with respect to tension in the lateral direction of the film 1. Also, the tangential coefficients of both the S-S curves are made positive in all ranges.</p> |
申请公布号 |
JPH11297646(A) |
申请公布日期 |
1999.10.29 |
申请号 |
JP19980115982 |
申请日期 |
1998.04.10 |
申请人 |
TECHNO ONISHI:KK;TOYOBO PACKAGING PLAN SERVICE:KK;MARUSHO KK |
发明人 |
SUGIMOTO EIICHI;ISAKA TSUTOMU;YOSHIOKA YASUO |
分类号 |
C09J7/02;C09J11/06;C09J133/00;H01L21/301;(IPC1-7):H01L21/301 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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