发明名称 FILM FOR SUPPORTING SEMICONDUCTOR CHIP
摘要 <p>PROBLEM TO BE SOLVED: To prevent a necking in an expanding process by making a film mainly of a mixture made of specific material and by establishing a certain relationship between a stress of an s-s curve to a tensile strain in the longitudinal direction and a stress of an s-s curve to a tensile strain in the lateral direction and by making the tangential coefficients of both the s-s curves in all the ranges. SOLUTION: The main constituent of a film 1 is a mixture ofα-olefin polymer of polyethylene, polypropylene, or polybutene andα-olefin copolymer having 2 to 8 carbon atoms. There is a relationship ofσr =(0.8 to 1.2)σc , whereσr is a stress of an S-S curve to the maximum tensile strain in all radial directions when the film 1 is expanded with respect to tension in the longitudinal direction of the film 1 andσc is a stress of an S-S curve to the maximum tensile strain in all radial directions when the film 1 is expanded with respect to tension in the lateral direction of the film 1. Also, the tangential coefficients of both the S-S curves are made positive in all ranges.</p>
申请公布号 JPH11297646(A) 申请公布日期 1999.10.29
申请号 JP19980115982 申请日期 1998.04.10
申请人 TECHNO ONISHI:KK;TOYOBO PACKAGING PLAN SERVICE:KK;MARUSHO KK 发明人 SUGIMOTO EIICHI;ISAKA TSUTOMU;YOSHIOKA YASUO
分类号 C09J7/02;C09J11/06;C09J133/00;H01L21/301;(IPC1-7):H01L21/301 主分类号 C09J7/02
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