| 摘要 |
PROBLEM TO BE SOLVED: To allow using an insulating sheet of a variety of materials as an insulating layer, related to a both-sided substrate and multi-layer substrate where a via hole is filled with conductive paste. SOLUTION: Using the one where adhesive layers are laminated on both surfaces of an insulating sheet of insulating resin as an insulating layer allows a variety of insulating material options. Further, in a process similar to conventional multilayer substrate manufacturing process such as drilling, filling of conductive paste, and hot press curing under hot press, a both-sided substrate and a multi-layer substrate with good conductivity are manufactured. |
