MULTILAYERED PRINTED WIRING BOARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To obtain a multilayered printed wiring board which can be widely used in various types of electronic devices and which can be mounted with a high density with a small land diameter in an outer layer and without any through-hole. SOLUTION: A light-sensitive insulating resin layer 4 is formed by laminating a film-like insulating resin on an insulating substrate 3 as an inner layer having a conductive pattern 2 for the inner layer and a conductive hole filled with conductive paste, and then the substrate is subjected to light exposing and developing processes to form a non-through hole therein. Next the substrate is formed therein with a photo via 5 for electric connection of conductive patterns 2 and 6 for the inner and outer layers by metal plating or the like. Thereafter the conductive pattern 6 for the outer layer is formed on the metal surface thereof by means such as a screen printing or a photography, thus manufacturing a multilayered printed wiring board 7 for high density mounting.