| 摘要 |
PROBLEM TO BE SOLVED: To prevent the heat that is generated in a lamination process and also the slippage that is caused in a following cutting process by piling up together the positioned upper resin sheet, inlet sheet and lower resin sheet and then laminating tentatively these sheets together. SOLUTION: An IC chip 23 is mounted on an inlet sheet 21 and then connected to an antenna 24. Then the surface of the chip 23 is sealed by the thermoplastic resin, and plural take-up resin sheets 22 are positioned and piled on the top and under sides of the sheet 21. At the same time, a window hole is drilled through a single resin sheet that is piled on the sheet 21 at its side where the chip 23 is mounted and also at the piling position of the chip 23. Then the window hole is positioned and piled on the chip 23 and the chip 23 is tentatively laminated via the ultrasonic fusion etc. |
