| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for loading the semiconductor chip of a small chip thickness to a loading member. SOLUTION: This loading method for the semiconductor chip 6 is, provided with a device formation surface and the back surface on a die pad 18 which is provided with a process for abutting the flat chucking surface of a vacuum collet for chucking the semiconductor chip 6 to the device formation surface of the semiconductor chip 6 and chucking it, the process for providing an eutectic alloy 20 for fixing the semiconductor chip 6 to a die pad 18 on the loading surface of the die pad 18, an arranging process for transferring the semiconductor chip 6 chucked by the vacuum collet and sandwiching the eutectic alloy 20 there between by the back surface and the loading surface, a pressurizing process for abutting the flat contact surface of a glass plate material 22 to the device formation surface of the semiconductor chip 6, clamping the semiconductor chip 6 by the die pad 18 and the glass plate material 22 and adding a pressure to the semiconductor chip 6 and a heating process for heating the semiconductor chip 6, while clamping it by the glass plate material 22 and the die pad 18.</p> |
