| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the phase failure of a metal mask which is caused by adopting an etching process when the thickness of the metal mask is changed partially in order to increase or reduce the quantity of cream solder to be printed while corresponding to a lead terminal pitch etc., of a mounted part. SOLUTION: This method comprises a process in which the surface of a matrix 20 is uniformly covered with a photo resist 21, a process in which the resist 21 is covered with a mask 22, is exposed and undergoes baking and photo resist 21a having a shape corresponding to openings 22a of the mask is caused to remain partially on the matrix 20 by developing it, a 1st plating process in which a metal is subjected to plating formation on a matrix 20 surface except the part covered with the resist 21 that remains partially on the matrix 20, a process in which the resist 21 and a top plane including a part of the metal are covered with another photo resist 21, a process in which another metal that has the same material as the metal is overlapped on a metal surface that is not covered with the other resist 21 and is subjected to plating formation, a process in which the entire resist 21 is removed and a process in which a metal mask that unites each of the metals is peeled from the matrix 20. |
